sz_Fujitsu -tech

Japanese company Fujitsu is ready to bring one the solutions for cooling used in SPARC servers M10 into the mobile devices.
It comes to technology Liquid Loop Cooling, which uses a closed system for circulating the coolant around the motherboard for better removal of heat generated.

Therefore, the company has developed a new technology that sets the first closed heat pipe with a thickness of less than 1 mm.

Heat pipe is a device for the transmission of energy, which includes an evaporator, absorbing heat from the source of such capacitor (heat exchanger), which dissipates. The two parts are connected to the closed tubes, in which the working fluid is moving – the heat it evaporates, thereby reducing the temperature of the source.

Fujitsu believes that the technology could find wide application of different cooling equipment as metal elements can be made in any form.

The company is ready to offer ready to use edition of the technology in 2017.

https://i0.wp.com/szlifestyle.com/sz/wp-content/uploads/2015/03/sz_Fujitsu-tech.jpg?fit=470%2C470https://i0.wp.com/szlifestyle.com/sz/wp-content/uploads/2015/03/sz_Fujitsu-tech.jpg?resize=150%2C150Nicolas T.TECH NEWSFujitsu,smartphone,TechnologyJapanese company Fujitsu is ready to bring one the solutions for cooling used in SPARC servers M10 into the mobile devices. It comes to technology Liquid Loop Cooling, which uses a closed system for circulating the coolant around the motherboard for better removal of heat generated. Therefore, the company has developed...